Tyco Electronics Corporation (NYSE: TEL) will showcase its latest advancements in interconnect solutions at DesignCon 2010. Tyco will be providing demonstrations of its next-gen high speed interconnects for backplane and I/O products which operate in the 20-25 Gb/s range.
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DesignCon is being held in Santa Clara, California from February 2-3, 2010 at the Santa Clara Convention Center. The company will be positioned at Booth #715.
Tyco Electronics Ltd. is a leading global provider of engineered electronic components, network solutions, specialty products and undersea telecommunication systems, with fiscal 2009 sales of US$10.3 billion to customers in more than 150 countries.
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