Scottsdale, Arizona 7/25/2008 12:22:06 AM
News / Finance

QualityStocks News – Credence Systems Corp. (CMOS) Receives Best New Product Award for its Innovative Semiconductor Advances

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We would like to highlight Credence Systems Corp. (NASDAQ: CMOS). The company is a global provider of automated test equipment (ATE) solutions to the high growth, consumer semiconductor industry. Credence is committed to deliver the highest standards of value -- an optimal combination of technology, turn-around time, reliability, ease of use, service and support -- to every customer, which enables important cost and performance advantages for integrated device manufacturers (IDMs), wafer foundries, outsource assembly and test (OSAT) suppliers and fabless chip companies worldwide.

 

In the company’s news yesterday,

 

Credence Systems Corp. announced its MultiWave instrument for the Diamond test platform has received the Advanced Packaging Best New Product Award in the Test and Services category, an award that recognizes the company’s advances in the competitive market.

 

Lavi Lev, president and CEO of Credence, said the MultiWave provides a low cost solution for multisite testing. The system incorporates four arbitrary waveform generators and four digitizers into a single compact instrument that allows for concurrent testing of audio and video system-in-package (SiP) and system-on-chip (SoC) devices.

 

“We are committed to offering our customers the best value in test, and the Diamond MultiWave instrument solves a full range of testing challenges for cost competitive markets. High-level integration combined with the lowest cost per channel help to address the relentless pressure to reduce the cost of test,” Lev stated in the press release. “We are delighted that Advanced Packaging has recognized the excellence of the Diamond MultiWave by presenting us with this award.”

 

“We congratulate Credence on its win of the prestigious Best New Product award in the Testing Equipment and Services category,” Gail Flower, editor-in-chief of Advanced Packaging magazine stated. “Advanced Packaging is proud to continue its tradition of recognizing excellence in this segment of the industry. In recent years, innovations in advanced packaging processes, materials, and equipment have been driving the semiconductor industry forward. Now more than ever, it’s important to acknowledge the achievements of these innovators.”

 

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